Sensitron - Custom Packaging

Products
Custom Design

From engineering design, packaging, to finished product, our advanced simulation and modeling tools enable us to provide you with innovative product to meet your power solution requirements. Sensitron's Advanced Baseless Packaging Technology is a cost effective packaging solution that generates maximum weight savings with high thermal conductivity and fatigue resistance.

Product Features:

Lower profile and light weight
Lowest possible thermal resistance
Excellent thermal fatigue resistance
Higher temperature applications
Lower cost
Automation friendly
Hermetic or plastic

Module Design Considerations:

•Optimum baseplate options

•Design for excellent thermal fatigue resistance

•Higher temperature design

•Light weight designs

•Space grade hermetic packages

•Extended temp range plastic module packages

•Full military temp range, shock, vibration & environmental factors

•High current, low inductance packages

Module Packaging Comparison

	Advanced	Traditional
	Baseless Packaging Technology	Copper Baseplate	Alsic Baseplate	Aluminum Baseplate	IMS Technology (AL)
Thermal Performance
Thermal resistance index	0.4	1.0	1.1	1.2	1.4
Max usable temperature	200°C	150°C	150°C	150°C	150°C
Fatigue resistance	superior	fair	good	poor	excellent
Flatness (per inch)	<=0.003	>=0.005	N/A	>=0.005	>=0.005
Cost factor	$	$$$$	$$$$$	$$$	$$
Weight index	0.2	1.0	0.5	0.5	0.5
Typical package height (for a comparable module)	0.2 inch	0.325 inch	0.37 inch	0.325 inch	0.325 inch

Power Packaging & Cooling
SMD-0.2,0.5 High Strength Packages:

Patented rugged package design
Enhanced temperature/power cycling capability over standard SMD-0.2 package
Package and PCB Temperature cycling verification complete. White paper available.
Options to ground different nodes to lid (per datasheet)
Samples available

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